Elettronica
Advanced Semiconductor Packaging Market Size Worth USD 40.3 billion, at a CAGR of 5.2% by 2031 - Transparency Market Research, Inc.
Chips and other semiconductor devices are packaged using advanced semiconductor packaging. There are several forms of advanced semiconductor packaging, including 2.5/3D, Flip Chip (FC), Fan-out Wafer-level Packaging (FOWLP), and Fan-in Wafer-level Packaging (FIWLP).
Vendors are funding the research and development of new materials and manufacturing techniques needed to produce cutting-edge semiconductor packaging.
These companies expand their regional footprint in the global market by collaborating with other companies and making strategic acquisitions. The following companies are well-known participants in the global advanced semiconductor packaging market:
Semiconductor devices that need more external connections and a higher integration level employ FOWLP technology. Wafer-level IC packaging is done using FIWLP. For many interconnects with shorter lengths than wire, the active portion of the chip is "flipped over" in FC, pointing downward.
Various reasons are propelling the growth of the advanced semiconductor packaging market throughout the region. These are:
The industry was valued at
US$ 44.2 Bn in 2021
It is estimated to advance at a CAGR of 20.1% from 2022 to 2031 and reach
US$ 267.7 Bn by the end of 2031
The industry was valued at
US$ 240.2 Mn in 2021
It is estimated to grow at a CAGR of 6.6% from 2022 to 2031 and reach
US$ 438.6 Mn by the end of 2031
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