Information Technology
E&R Engineering Corp. Unveils Cutting-Edge Solutions at Semicon SEA 2024 in Kuala Lumpur
E&R offers a hybrid solution combining laser grooving and plasma dicing, allowing for dice lanes controlled between 10um ~ 30um. In addition to equipment manufacturing, E&R also provides the to process wafers into small dies for various shapes, hexagonal, circular or MPR pattern.
With extensive expertise in the integration of self-developed optics module and advanced laser system, E&R provides a laser drilling solution for 2.5D/3D packaging, featuring high accuracy up to +/- 5um, of which the B/T ratio achieves 85~90%. Besides, E&R is also renowned for its precision laser marking integrated with 4 beam marking solution for high throughput while remaining +/- 25um accuracy, excellence in heat affect control for laser cutting process, and high uniformity (CPK >1.33) plasma solutions.
E&R is one of the leading equipment manufacturers supporting glass substrate process. Besides high productivity TGV solutions reaching 600~1,000 VPS while maintaining an accuracy of 5 um-3 sigma, E&R also provides advanced solutions for Glass Laser Polishing to improve the roughness of glass sidewall, laser beveling, and AOI techniques.
E&R provide a series of solutions including shallow layer laser annealing after ion implantation, to activate ions and restore the crystal lattice, SiC wafer ID marking and plasma cleaning. Additionally, E&R also launches the Raman Inspection Machine to detect crack, defect and internal stress, to efficiently enhance the process yield.
E&R develops a full range of machines supporting large panel process up to 700*700mm panel size, containing laser marking, cutting and plasma cleaning and de-smear after drilling. The competence on warpage handling excellently reaches 16mm while remaining the high throughput competence.
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Malaysia International Trade and Exhibition Center
May.28 to 30 , 2024
https://en.enr.com.tw/
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