E&R Engineering Corp. Forms E-Core System Alliance: Leading Glass Substrate into the Mass Production Era

E&R will continue leading the development of glass substrate technology in Taiwan, optimizing processes, and collaborating with more industry partners to achieve excellence. E&R will continue leading the development of glass substrate technology inTaiwan, optimizing processes, and collaborating with more industry partners to achieve excellence. With the rapid growth in demand for AI chips, high-frequency, and high-speed communication devices, glass substrates in advanced packaging...

Taipei, Taiwan, 02/09/2024 (informazione.it - comunicati stampa - information technology)

E&R will continue leading the development of glass substrate technology in Taiwan, optimizing processes, and collaborating with more industry partners to achieve excellence.

With the rapid growth in demand for AI chips, high-frequency, and high-speed communication devices, glass substrates in advanced packaging technologies are becoming increasingly important. Compared to the widespread use of copper foil substrates, glass substrates offer higher wiring density and better signal performance. Additionally, glass provides high flatness and can withstand high temperatures and voltages, making it an ideal replacement for traditional substrates.

The glass substrate process involves glass metallization, ABF (Ajinomoto Build-up Film) lamination, and final substrate cutting. Key steps in glass metallization include TGV (Through-Glass Via), wet etching, AOI (Automated Optical Inspection), sputtering, and plating. These substrates measure 515×510mm, representing a new process in semiconductor and substrate manufacturing.

The critical aspect of glass substrate technology is the first step—glass laser modification (TGV). Although introduced over a decade ago, its speed had not met mass production requirements, achieving only 10 to 50 vias per second, limiting the market impact of glass substrates. E&R Engineering Corp. (8027.TWO) has been working with a North American IDM customer for the past five years to develop glass laser modification TGV technology. Last year, the process passed validation, with E&R mastering key technology, now achieving up to 8,000 vias per second for fixed patterns (matrix layout) or 600 to 1,000 vias per second for customized patterns (random layout), with an accuracy of +/- 5 μm, meeting the 3 sigma standard. This breakthrough has finally enabled glass substrates to reach mass production.

E&R will also showcase the latest technologies at SEMICON Taiwan 2024 and SEMICON Europa 2024.