Radiation Hardened Electronics Market on Track to Surpass $2.1 Billion by 2029

It is projected that the Radiation Hardened Electronics Market would rise from USD 1.7 billion to USD 2.1 billion between 2024 and 2029, at a compound annual growth rate (CAGR) of 4.8%.

Pune, 16/04/2024 (informazione.it - comunicati stampa - scienza e tecnologia)

The Radiation Hardened Electronics Market is expected to rise significantly, from USD 1.7 billion in 2024 to USD 2.1 billion in 2029. From 2024 to 2029, this growth is anticipated to occur at a compound annual growth rate (CAGR) of 4.8%.

The market's growth is ascribed to multiple factors, such as technological progress, growing applications in crucial industries like defence and aerospace, and an increase in the need for radiation-resistant electronic components. The need for radiation-hardened electronics is anticipated to soar as long as industries continue to place a high value on dependability and resilience in challenging conditions. This will propel the market's growth trajectory throughout the projected timeframe.

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Radiation-hardened electronics are becoming increasingly necessary for military applications, especially for more contemporary military platforms like drones, tanks, and fighter jets. Critical operations aboard these platforms, such as communication, navigation, weapon control, and surveillance, mainly depend on electronic equipment. Radiation hardening becomes essential to guarantee the dependable operation of these electronic equipment in challenging circumstances, given the more complicated electromagnetic environment of modern warfare. Military missions can proceed with increased confidence in the functionality and robustness of their electronic systems by incorporating radiation-resistant components, which will improve overall operational effectiveness and mission success.

Radiation Hardened Electronics Market Report Scope:

Report Coverage

Details

Market Revenue in 2024

$ 1.7 billion

Estimated Value by 2029

$ 2.1 billion

Growth Rate

Poised to grow at a CAGR of 4.8%

Market Size Available for

2020–2029

Forecast Period

2024–2029

Forecast Units

Value (USD Million/Billion)

Report Coverage

Revenue Forecast, Competitive Landscape, Growth Factors, and Trends

Segments Covered

By Component, Manufacturing Techniques, Product Type, Application and Geography

Geographies Covered

North America, Europe, Asia Pacific, and Rest of World

Key Market Challenge

Customized requirements from high-end consumers

Key Market Opportunities

Increasing demand for commercial-off-the-shelf components in space satellite

Key Market Drivers

Increasing intelligence, surveillance, and reconnaissance (ISR) activities

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Mixed-signal ICs component to hold the significant market size of radiation-hardened electronics industry during the forecast period.

The semiconductor industry relies heavily on analogue devices, especially for applications like signal processing and microcontrollers that need to convert analogue data to digital data. Due to their ability to process digital and analogue signals simultaneously, mixed-signal devices offer even more capabilities. These systems are versatile and can be used in a variety of ways, such as printed circuit boards, individual integrated circuit (IC) chips, or hybrid microcircuits. But in high-risk locations like space, where radiation exposure can cause electrical malfunctions, it becomes critical to make sure analogue and digital circuits are resilient. For analogue systems to survive the difficulties presented by radiation in demanding applications like space exploration, radiation hardening techniques are therefore essential.

Custom-made in product type segment is expected to grow at the second fastest CAGR during the forecast period.

Specifically designed radiation-hardened electronic components comprise a wide range of specialised products designed to satisfy the demanding specifications of high-risk settings. A customised digital ASIC platform, microprocessors, parts for analogue and mixed-signal processing, unique magnetics, discrete power transistors, and fiber-optic components are some of these parts. These components are unique because of their innately radiation-hardened design, which guarantees resilience in the event of radiation exposure. These elements need to follow thorough guide architecture specifications in order to perform as intended in their intended applications. This includes factors like power conditioning, module layout optimisation, mechanical shielding, and the integration of auxiliary instrument circuits. Custom radiation-hardened electronic components provide dependable performance in harsh settings where radiation exposure presents serious operating issues by taking care of these crucial factors.

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ROW expected to grow with second highest CAGR the radiation-hardened market during the forecast period.

The Middle East, Africa, the Gulf Cooperation Council, and South America make up the Rest of the World market, which is expanding rapidly due to developments in satellite production and launch capabilities. The space industry has seen a revolution with the introduction of small satellites, which have reduced the cost of satellite production and deployment to levels never seen before. Furthermore, the idea of hosted satellite launches has gained popularity, providing more frequent access to space at lower prices and with shorter lead times than dedicated missions for governments, academic institutions, and other organisations. Increased demand for satellite technology and related services in these regions is a result of these advancements, which have created new opportunities for players in the Rest of the World market.

Key Market Players

Major players in radiation-hardened electronics companies are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor (US).

News Covered:

https://www.prnewswire.com/news-releases/radiation-hardened-electronics-market-worth-2-1-billion-by-2029---exclusive-report-by-marketsandmarkets-302081000.html 

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