YES Panel-Level Through Glass Via (TGV) Etch Tool Placed in Production

"YES has maintained its leadership position in the advanced packaging market segment by enabling customer roadmaps through the delivery of superior products with low cost-of-ownership and high reliability. The TersOnus TGV delivers on this commitment by providing excellent etch rates and aspect ratios for the most challenging through glass vias all the while reducing manufacturing cycle times. The TersOnus TGV is just one of many products that YES has introduced and will be introducing to the burgeoning glass panel market to support AI advancement," Rezwan Lateef, President of YES concluded.

FREMONT, Calif., 02/07/2024 (informazione.it - comunicati stampa - information technology)

About YES

YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company's product lines include vacuum cure ovens, chemical vapor deposition systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.