Telecomunicazioni
Embedded Subscriber Identity Module (E-SIM) Market to Reach $12,673.03 Million, Globally, by 2032 at 14.3% CAGR: Allied Market Research
The embedded subscriber identity module (E-SIM) market analysis is anticipated to expand significantly during the forecast period owing to a surge in adoption of IoT technology and an increase in the adoption of connected devices. Additionally, the market for embedded subscriber identity modules (E-SIMs) is expected to benefit from the adoption of enterprise solutions. However, device compatibility poses a restraint to the growth of the embedded subscriber identity module (E-SIM) market during the forecast period.
Based on application, the connected car segment accounted for over one-third of the total revenue in the global embedded subscriber identity module (E-SIM) market in 2022, and it is expected to continue its dominant position throughout the forecast period. Additionally, this segment is projected to experience the of 15.58% from 2023 to 2032. The primary factors contributing to its dominance and growth are the increasing adoption of connected car technology, the demand for enhanced safety and security features, the growth of vehicle management and telematics services, and regulatory mandates driving the standardization of E-SIMs in the automotive industry.
Based on industry vertical, the automotive segment emerged as the market leader in the global embedded subscriber identity module (E-SIM) market in 2022, holding the highest market share of one-fourth of the revenue. The remarkable growth of the automotive segment can be attributed to several factors. These include the increasing integration of connectivity features in vehicles, the growing demand for enhanced safety and security, the focus on vehicle telematics and data analytics, and the influence of regulatory mandates and standardization efforts in the automotive industry. The telecommunication segment is expected to experience the fastest CAGR of 16.27% from 2023 to 2032.
Based on region, North America dominated the embedded subscriber identity module (E-SIM) market revenue in 2022, representing approximately one-third of the global market share. This region is expected to witness the fastest CAGR of 15.39% from 2023 to 2032. The primary reasons for this dominance are the strong presence of automotive and IoT industries, early adoption of advanced technologies, a favorable regulatory environment, increasing demand for connected services, technological innovations, and a robust consumer electronics market.
The report provides a detailed analysis of these key players of the global embedded subscriber identity module (E-SIM) market. These players have adopted different strategies such as agreements, mergers, partnerships, product launches, collaborations, and new product development to increase their market penetration and strengthen their position in the industry. The report is helpful in determining the business performance, operating segments, developments, and product portfolios of every market player.
by Modem Type (Internal/Integrated, External), by Mode (Single-Mode, Multimode), by Application (Mobile and Tablets, Wearable, Automotive, Virtual Reality, Others): Global Opportunity Analysis and Industry Forecast, 2021-2031
by Component (Hardware, Software), by Application (Automotive, Consumer Electronics, Industrial, Aerospace and Defense, Others): Global Opportunity Analysis and Industry Forecast, 2021-2031
by Density (2GB–4GB, 8GB–16GB, 32GB–64GB, and 128GB-256GB), Application (Smartphones, Digital Cameras, GPS Systems, Medical Devices, and Others), and End User (Automotive, Aerospace & Defense, Industrial, Healthcare, Public, IT & Telecom, and Other): Global Opportunity Analysis and Industry Forecast, 2021–2028
by Industry Vertical (Automotive, Industrial Machinery, Infrastructure, and Healthcare & Life Science): Global Opportunity Analysis and Industry Forecast, 2020–2026
by Product Type (Computing Devices & Equipment, Servers & Routers, RF & Microwave, Fiber Optic Devices, Transceivers & Transmitters, and Others), and Service (Electronic Design and Engineering, Electronics Assembly, Electronic Manufacturing, Supply Chain Management, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027
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