Information Technology
MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
"The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game," said Dr. Yenchi Lee , Deputy General Manager of MediaTek's Wireless Communications Business. "Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support."
The Dimensity 7300 chipsets also offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Enhanced with new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 lets users capture stunning images and videos in any lighting. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos.
The MediaTek APU 655 significantly boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also accommodate new mixed precision data types to more efficiently utilize memory bandwidth and reduce memory requirements for larger AI models.
With MediaTek's MiraVision 955 built-in, the Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. Additionally, the dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors.
Other key features of the Dimensity 7300 and the Dimensity 7300X include:
To learn more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g .
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