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Copper Clad Laminates Market worth $21.6 billion in 2027 - Exclusive Report by MarketsandMarkets™
https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=100748480
Copper clad laminate or CCL is a type of material used in PCBs. It is made using reinforcement materials like glass fiber, paper, or other materials, impregnated with resin adhesive like epoxy, phenolic etc. and covered with copper foil on either side or one side. The Copper clad laminates Market has been segmented based on its type i.e., rigid copper clad laminate and flexible copper laminate. The rigid laminates are used in several end-use applications including consumer electronics, communications, automotive, and aerospace industries. The rigid copper clad laminates dominate the market owing to its wide application base, enhanced properties, strength and durability.
The Copper clad laminates market has been segmented based on the reinforcement material. The market is segmented as fiber glass, paper base and compound materials as per the reinforcement material used in the copper clad laminates. The fiberglass reinforcement material segment of the market dominates the market. The high market share is mainly driven by its application in different electronic products as it provides better electronic performance and cost-effectiveness.
The Copper clad laminates market has been segmented based on the resins used in the copper clad laminates i.e., epoxy, phenolic, polyimide and others. Epoxy is the most common resin used in copper clad laminates. Due to a wide application base like home appliances, IT peripherals, consumer electronics, and electronic communication systems, it dominates the market. Paper-phenolic copper clad laminates are cost effective. It is used in IT peripherals, communication systems and consumer electronics.
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Copper clad laminates can be used in a variety of applications like computers, communication systems, consumer appliances, vehicle electronics, healthcare devices and defense technology. According to projections, the communication systems will be the biggest market for copper clad laminates. The market for 5G infrastructure is expanding as a result of rising acceptance of virtual networking in the telecom industry, lower latency in 5G, and an increase in mobile traffic data. High consumer demand and industrial automation generates increased demands for effective communication systems which drives the market for copper clad laminates.
The largest market for copper clad laminates is anticipated to be in APAC over the projected period.
China , Taiwan ,
South Korea and Japan are the main contributors in the same. The growth is led by rapid increasing demand for copper clad laminates from various industries, including computers, communication systems, consumer appliances, vehicle electronics, healthcare devices etc. The investments in 5G infrastructure and technological shift in automobile sector to electric vehicles is a major reason for growth of copper clad laminate market.
Some of the key players in the global copper clad laminates market are Kingboard Laminates Holdings Ltd. ( China ), Shengyi Technology Co., Ltd ( China ), Nan Ya Plastics Corporation ( Taiwan ), Panasonic Holdings Corporation ( Japan ), Taiwan Union Technology Corporation ( Taiwan ) and others.
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