Information Technology
DFI Accelerates Edge AI Innovation at Embedded World 2025
Designed for harsh environments, DFI's rugged platforms include the ECX700 series for mission-critical durability and the QRB812 OSM, a compact 45mm × 45mm module with Qualcomm QRB5165 for AI-powered smart surveillance, UAVs, and automated inspections. DFI is actively engaged in UAV projects using this technology.
DFI partners with Irontech Group, a Spain -based industrial PC leader, to showcase rugged panel PCs (ATEX, IP69K) built for marine, food industry, logistics, and industrial automation.
DFI emphasizes expandability with the EC633D-RPS, a fanless embedded system supporting 65W 14th/13th/12th Gen Intel Core™ processors and a high-performance GPU, enabling on-device LLM deployment with DeepSeek. The edge server lineup includes the MPC350-RPS, a medical-grade AI server with RTX5070 GPU support, and the RM646 -ERX810, a 4U short-depth AI server with dual 5th Gen Intel Xeon processors and three PCIe GPUs. DFI also partners with AEWIN to showcase the BAS-6101A, a 2U edge server for cloud and high-performance computing. Additionally, DFI collaborates with DEEPX to integrate the DX-M1 M.2 AI accelerator into the EC700-ADN, a compact fanless system for enhanced AI performance.
Visit DFI at Booth 3-533 at Messe Nuremberg from March 11–13, 2025, and explore award-winning innovations at the Taiwan Excellence booth 2-313.
View original content: https://www.prnewswire.co.uk/news-releases/dfi-accelerates-edge-ai-innovation-at-embedded-world-2025-302396814.html