Interposer and Fan-out Wafer Level Packaging Market Anticipated to Reach $63.5 Billion by 2029
Articolo Precedente
Articolo Successivo
The global Interposer and Fan-out Wafer Level Packaging (FOWLP) Market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029.
Download PDF Brochure @ https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=130599842
Market participants have adeptly addressed rising advanced packaging demands in diverse industries, extending their global reach through strategic growth approaches like introducing new products, fostering collaborations, establishing alliances, forging partnerships, and expanding their operations.
Inquire Before Buying @ https://www.marketsandmarkets.com/Enquiry_Before_BuyingNew.asp?id=130599842
Key players operating in the interposer and fan-out wafer level packaging (FOWLP) market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Advanced Micro Devices, Inc. (US), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan) among others.
Taiwan Semiconductor Manufacturing Company, Ltd (Taiwan)
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) is a leading semiconductor foundry engaged in the research, development, manufacturing, and distribution of integrated circuits (ICs) and related products. In packaging and testing services, the company offers 3D fabric design solutions, which include TSMC-SoICTM (System on Integrated Chip) for 3D chip stacking and 2.5D advanced packaging to drive greater system performance. These products are used in a variety of end markets, including smartphones, high-performance computing, the Internet of Things (IoT), automotive, and digital consumer electronics.
Browse For More Details - https://www.marketsandmarkets.com/Market-Reports/interposer-fan-out-wlp-market-130599842.html
Samsung (South Korea)
Samsung is engaged in the development of hardware devices, services, apps, semiconductor technology, etc. It is also a manufacturer of consumer electronics, information technology and mobile communications, and device solutions. The company’s DS segment includes Memory, Foundry, and LSI (Semiconductor) systems, 3D IC packaging, as well as display devices such as LCD and OLED (DP) panels.
ASE Technology Holding Co. Ltd. (Taiwan)
ASE Technology Holding Co., Ltd. is one of the leading providers of semiconductor manufacturing services in assembly and testing. The company provides solutions for IC packaging, materials, and Electronic Manufacturing Services (EMS), as well as front-end engineering tests, wafer probing, and final tests. The Electronics Packaging Technology and Manufacturing Service business segments offer a full range of semiconductor testing services, including Package and module design, chip packaging (or assembly), multi-chip assembly, micro and hybrid module assembly, memory assembly.
News Covered:
https://www.prnewswire.com/news-releases/interposer-and-fan-out-wafer-level-packaging-market-worth-63-5-billion-by-2029---exclusive-report-by-marketsandmarkets-302057426.html
About MarketsandMarkets™
MarketsandMarkets™ is a blue ocean alternative in growth consulting and program management, leveraging a man-machine offering to drive supernormal growth for progressive organizations in the B2B space. We have the widest lens on emerging technologies, making us proficient in co-creating supernormal growth for clients.
The B2B economy is witnessing the emergence of $25 trillion of new revenue streams that are substituting existing revenue streams in this decade alone. We work with clients on growth programs, helping them monetize this $25 trillion opportunity through our service lines - TAM Expansion, Go-to-Market (GTM) Strategy to Execution, Market Share Gain, Account Enablement, and Thought Leadership Marketing.
Built on the 'GIVE Growth' principle, we work with several Forbes Global 2000 B2B companies - helping them stay relevant in a disruptive ecosystem. Our insights and strategies are molded by our industry experts, cutting-edge AI-powered Market Intelligence Cloud, and years of research. The KnowledgeStore™ (our Market Intelligence Cloud) integrates our research, facilitates an analysis of interconnections through a set of applications, helping clients look at the entire ecosystem and understand the revenue shifts happening in their industry.
To find out more, visit www.MarketsandMarkets™.com or follow us on Twitter, LinkedIn and Facebook.
Contact:
Mr. Aashish Mehra
MarketsandMarkets™ INC.
630 Dundee Road
Suite 430
Northbrook, IL 60062
USA: +1-888-600-6441
Visit Our Website: https://www.marketsandmarkets.com
MarketsandMarkets (Leggi tutti i comunicati)
Tower B5, office 101, Magarpatta SEZ, Hadapsar, Pune-411013, India
411013 Pune
[email protected]
+1-888-600-6441